Nov 30, 2020
Flip Chip Bonder Market Size 2020 Analysis By Worldwide Industry Trends, Share, Gross Margin, Future Demand, Investment Opportunities, Analysis and Forecast by Top Leading Players till 2026
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Global “Flip Chip Bonder Market” is a comprehensive research that provides information regarding Flip Chip Bonder market size, trends, growth, cost structure, capacity, revenue and forecast 2026. This report also includes the overall study of the Flip Chip Bonder Market share with all its aspects influencing the growth of the market. This report is exhaustive quantitative analyses of the Flip Chip Bonder industry and provides data for making strategies to increase Flip Chip Bonder market growth and effectiveness. The report further investigates and assesses the current landscape of the ever-evolving business sector and the present and future effects of COVID-19 on the Flip Chip Bonder market.
In 2019, the global Flip Chip Bonder market size was USD 350.1 million and it is expected to reach USD 595.7 million by the end of 2026, with a CAGR of 7.8% during 2021–2026.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a “flipping device”
2. Die is “flipped” and moved to hover over the substrate (or board or carrier) where bumps reside-precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a “spacer” to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
BESI was the world’s biggest manufacturer in the Flip Chip Bonder industry, accounted for 28% revenue market share of the global market, followed by SCG Packaging, Canfor Corporation, Canadian Kraft Paper Industries, Georgia-Pacific, Mondi Group, BillerudKorsnas , Tokushu Tokai Paper Co., Ltd., Stora Enso, Smurfit Kappa, Segezha Group, Taiko Paper, Chuetsu Pulp & Paper, Gascogne, Nordic Paper.The top 5 companies had a combined market share of 83% of the global total.Europe was the largest consumption and production area in the world in 2018.
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Market Analysis and Insights: Global Flip Chip Bonder Market
- Since the COVID-19 virus outbreak in December 2019, the disease has spread to almost 100 countries around the globe with the World Health Organization declaring it a public health emergency. The global impacts of the coronavirus disease 2019 (COVID-19) are already starting to be felt, and will significantly affect the Flip Chip Bonder market in 2020.
- COVID-19 can affect the global economy in three main ways: by directly affecting production and demand, by creating supply chain and market disruption, and by its financial impact on firms and financial markets.
- The outbreak of COVID-19 has brought effects on many aspects, like flight cancellations; travel bans and quarantines; restaurants closed; all indoor events restricted; over forty countries state of emergency declared; massive slowing of the supply chain; stock market volatility; falling business confidence, growing panic among the population, and uncertainty about future.
- This report also analyses the impact of Coronavirus COVID-19 on the Flip Chip Bonder industry.
The major players in the market include:
- BESI
- ASMPT
- Shibaura
- Muehlbauer
- K&S
- Hamni
- AMICRA Microtechnologies
- SET
- Athlete FA
The report identifies various key manufacturers of the market. It helps the reader understand the strategies and collaborations that players are focusing on combat competition in the market. The comprehensive report provides a significant microscopic look at the market. The reader can identify the footprints of the manufacturers by knowing about the global revenue of manufacturers, the global price of manufacturers, and production by manufacturers during the forecast period of 2015 to 2019.
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On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into:
- Fully Automatic
- Semi-Automatic
On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including:
- IDMs
- OSAT
Some of the key questions answered in this report:
- What will the market growth rate, growth momentum or acceleration market carries during the forecast period?
- Which are the key factors driving the Flip Chip Bonder market?
- What was the size of the emerging Flip Chip Bonder market by value in 2019?
- What will be the size of the emerging Flip Chip Bonder market in 2026?
- Which region is expected to hold the highest market share in the Flip Chip Bonder market?
- What trends, challenges and barriers will impact the development and sizing of the Global Flip Chip Bonder market?
- What are sales volume, revenue, and price analysis of top manufacturers of Flip Chip Bonder market?
- What are the Flip Chip Bonder market opportunities and threats faced by the vendors in the global Flip Chip Bonder Industry?
Global Flip Chip Bonder Market providing information such as company profiles, product picture and specification, capacity, production, price, cost, revenue and contact information. Upstream raw materials and instrumentation and downstream demand analysis is additionally dispensed. The Global Flip Chip Bonder market development trends and marketing channels are analyzed. Finally, the feasibility of latest investment projects is assessed and overall analysis conclusions offered.
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Years considered for this report:
- Historical Years: 2015–2019
- Base Year: 2019
- Estimated Year: 2020
- Flip Chip Bonder Market Forecast Period: 2020–2026
With tables and figures helping analyse worldwide Global Flip Chip Bonder market trends, this research provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.
Some Points from TOC:
1 Study Coverage
1.1 Flip Chip Bonder Product Introduction
1.2 Market Segments
1.3 Key Flip Chip Bonder Manufacturers Covered: Ranking by Revenue
1.4 Market by Type
1.4.1 Global Flip Chip Bonder Market Size Growth Rate by Type
1.4.2 Type 1
1.4.3 Type 2
1.4.4 Type 3
1.4.5 Others
1.5 Market by Application
1.5.1 Global Flip Chip Bonder Market Size Growth Rate by Application
1.5.2 Application 1
1.5.3 Application 2
1.5.4 Application 3
1.5.5 Others
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global Flip Chip Bonder Market Size, Estimates and Forecasts
2.1.1 Global Flip Chip Bonder Revenue 2015–2026
2.1.2 Global Flip Chip Bonder Sales 2015–2026
2.2 Global Flip Chip Bonder, Market Size by Producing Regions: 2015 VS 2020 VS 2026
2.2.1 Global Flip Chip Bonder Retrospective Market Scenario in Sales by Region: 2015–2020
2.2.2 Global Flip Chip Bonder Retrospective Market Scenario in Revenue by Region: 2015–2020
3 Global Flip Chip Bonder Competitor Landscape by Players
3.1 Flip Chip Bonder Sales by Manufacturers
3.2 Flip Chip Bonder Revenue by Manufacturers
3.3 Flip Chip Bonder Price by Manufacturers
3.4 Flip Chip Bonder Manufacturing Base Distribution, Product Types
3.5 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Market Size by Type (2015–2026)
4.1 Global Flip Chip Bonder Market Size by Type (2015–2020)
4.2 Global Flip Chip Bonder Market Size Forecast by Type (2021–2026)
4.3 Global Flip Chip Bonder Market Share by Price Tier (2015–2020): Low-End, Mid-Range and High-End
5 Market Size by Application (2015–2026)
5.1 Global Flip Chip Bonder Market Size by Application (2015–2020)
5.2 Flip Chip Bonder Market Size Forecast by Application (2021–2026)
6 North America
6.1 North America Flip Chip Bonder by Country
6.1.1 North America Flip Chip Bonder Sales by Country
6.1.2 North America Flip Chip Bonder Revenue by Country
6.1.3 U.S.
6.1.4 Canada
6.2 North America Flip Chip Bonder Market Facts & Figures by Type
6.3 North America Flip Chip Bonder Market Facts & Figures by Application
7 Europe
7.1 Europe Flip Chip Bonder by Country
7.1.1 Europe Flip Chip Bonder Sales by Country
7.1.2 Europe Flip Chip Bonder Revenue by Country
7.1.3 Germany
7.1.4 France
7.1.5 U.K.
7.1.6 Italy
7.1.7 Russia
7.2 Europe Flip Chip Bonder Market Facts & Figures by Type
7.3 Europe Flip Chip Bonder Market Facts & Figures by Application
8 Asia Pacific
……………………………………………….
11 Company Profiles
11.1 Company Profiles 1
11.1.1 Company Profiles 1 Corporation Information
11.1.2 Company Profiles 1 Description and Business Overview
11.1.3 Company Profiles 1 Sales, Revenue and Gross Margin (2015–2020)
11.1.4 Company Profiles 1 Flip Chip Bonder Products Offered
11.1.5 Company Profiles 1 Related Developments
11.2 Company Profiles 2
11.2.1 Company Profiles 2 Corporation Information
11.2.2 Company Profiles 2 Description and Business Overview
11.2.3 Company Profiles 2 Sales, Revenue and Gross Margin (2015–2020)
11.2.4 Company Profiles 2 Flip Chip Bonder Products Offered
11.2.5 Company Profiles 2 Related Developments
11.3 Company Profiles 3
11.3.1 Company Profiles 3 Corporation Information
11.3.2 Company Profiles 3 Description and Business Overview
11.3.3 Company Profiles 3 Sales, Revenue and Gross Margin (2015–2020)
11.3.4 Company Profiles 3 Flip Chip Bonder Products Offered
11.3.5 Company Profiles 3 Related Developments
11.4 Company Profiles 4
11.4.1 Company Profiles 4 Corporation Information
11.4.2 Company Profiles 4 Description and Business Overview
11.4.3 Company Profiles 4 Sales, Revenue and Gross Margin (2015–2020)
11.4.4 Company Profiles 4 Flip Chip Bonder Products Offered
11.4.5 Company Profiles 4 Related Developments
11.5 Company Profiles 5
11.5.1 Company Profiles 5 Corporation Information
11.5.2 Company Profiles 5 Description and Business Overview
11.5.3 Company Profiles 5 Sales, Revenue and Gross Margin (2015–2020)
11.5.4 Company Profiles 5 Flip Chip Bonder Products Offered
11.5.5 Company Profiles 5 Related Developments
………………………………………………………………………….
13 Market Opportunities, Challenges, Risks and Influences Factors Analysis
13.1 Market Opportunities and Drivers
13.2 Market Challenges
13.3 Market Risks/Restraints
13.4 Porter’s Five Forces Analysis
13.5 Primary Interviews with Key Flip Chip Bonder Players (Opinion Leaders)
14 Value Chain and Sales Channels Analysis
14.1 Value Chain Analysis
14.2 Flip Chip Bonder Customers
14.3 Sales Channels Analysis
14.3.1 Sales Channels
14.3.2 Distributors
15 Research Findings and Conclusion
Continued…………………………………….
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